Crystallographically Faceted Void Formation in the Matrix of Lead-Free Solder Joints

被引：17

作者：

Belyakov, S. ^{[1
]}

Atkinson, H. V. ^{[1
]}

Gill, S. P. A. ^{[1
]}

机构：

[1] Univ Leicester, Dept Engn, Leicester LE1 7RH, Leics, England

来源：

JOURNAL OF ELECTRONIC MATERIALS | 2010年 / 39卷 / 08期

关键词：

Lead-free solder; voiding; CU;

D O I：

10.1007/s11664-010-1184-6

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Crystallographically faceted void (CFV) formation in lead-free solder joints has been observed after solidification and during subsequent solid-state aging. Such voids have not previously been reported in the literature. This paper gives a preliminary report on observations of voids which tend to be associated with, and adjacent to, intermetallic compounds in the solder bulk and near-substrate interface region. It has been observed that CFVs are correlated with beta-Sn crystallographic orientation and form in a tetragonal shape. Aging promotes CFV clustering and growth.

引用

页码：1295 / 1297

页数：3

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