A Review On Performance Comparison Of SOI MOSFET With STS-SOI MOSFET

被引:0
作者
Karthick, S. [1 ]
Ajayan, J. [1 ]
Vivek, K. [1 ]
Arasan, C. Kavin [1 ]
Manikandan, A. [1 ]
机构
[1] MIT, Dept ECE, Pondicherry, India
来源
2015 2ND INTERNATIONAL CONFERENCE ON ELECTRONICS AND COMMUNICATION SYSTEMS (ICECS) | 2015年
关键词
Erbium silicide; metal source/drain (S/D); platinum silicide; Schottky barriers (SBs); SCHOTTKY-BARRIER SOURCE/DRAIN; MIXED-MODE; CHANNEL; DESIGN; TRANSISTOR; CMOS;
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
The last few decades have seen considerable progress in development of techniques for growing single crystal silicon film on insulator (SOI) substrates suitable for the fabrication of high performance devices. The SOI substrates promise to extend the range of applications including VLSI, memory, analog and digital integrated circuits and mixed signal applications. In this paper, the performance of SOI technology based SOI MOSFETs and schottky tunneling source SOI MOSFETs is reviewed. The SOI technology along with metallic S/D offers several benefits that enable scaling to sub 22nm gate lengths including extremely low S/D parasitic resistances, superior control of leakage current and elimination of bipolar latch up action. STS-FETs also benefits from the use of high-k dielectrics along with S/D engineering and gate engineering.
引用
收藏
页码:1401 / 1406
页数:6
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