Retarding the Cu5Zn8 phase fracture at the Sn-9 wt.% Zn/Cu interface

被引：38

作者：

Wang, Jin-Yi ^{[1
]}

Lin, Chih-Fan ^{[1
]}

Chen, Chih-Ming ^{[1
]}

机构：

[1] Natl Chung Hsing Univ, Dept Chem Engn, Taichung 402, Taiwan

来源：

SCRIPTA MATERIALIA | 2011年 / 64卷 / 07期

关键词：

Annealing; Soldering; Intermetallic compounds; Lead-free solder; BUMP METALLIZATION; ZN SOLDER; CU; NI;

D O I：

10.1016/j.scriptamat.2010.12.006

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

Cu5Zn8 phase was formed at the Sn-9 wt.% Zn/Cu interface after reflow, but this phase fractured very severely during subsequent solid-state annealing. By reducing the cooling rate of the reflow process, a thicker Cu5Zn8 phase was formed and the phase fracture was retarded during subsequent annealing, which retained the integrity of the Cu5Zn8 phase at the interface. The improvement in the Cu5Zn8 phase integrity was attributed to the maintenance of a local equilibrium at the interface. (C) 2010 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.

引用

页码：633 / 636

页数：4

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