Modeling and characterization of high-speed serial link interconnection media

被引：0
|
作者：
Miller, D [1 ]
Tripathi, A [1 ]
机构：
[1] Intel Corp, Enterprise Server Grp, Tech Dev, Server Architecture Lab, Beaverton, OR 97006 USA
来源：
2000 INTERNATIONAL SYMPOSIUM ON MICROELECTRONICS | 2000年 / 4339卷
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
The frequency-domain measurement based approach for modeling and characterization of elements of high-speed serial physical interconnection media physical media) is presented in this paper. The multi-port interconnects me characterized in terms of scattering matrix by using two-port VNA (vector network analyzer) measurements for 8b/10b encoded, 25Gb/s (bandwidth: 0.125GHz to 1.25GHz) data transfer applications. The results for the loss and jitter characteristics associated with the various components for implementation of low-cost high-speed serial links with FR4 hoard material are illustrated.
引用
收藏
页码：387 / 391
页数：5
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