Modeling and characterization of high-speed serial link interconnection media

被引：0

作者：

Miller, D ^{[1
]}

Tripathi, A ^{[1
]}

机构：

[1] Intel Corp, Enterprise Server Grp, Tech Dev, Server Architecture Lab, Beaverton, OR 97006 USA

来源：

2000 INTERNATIONAL SYMPOSIUM ON MICROELECTRONICS | 2000年 / 4339卷

关键词：

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The frequency-domain measurement based approach for modeling and characterization of elements of high-speed serial physical interconnection media physical media) is presented in this paper. The multi-port interconnects me characterized in terms of scattering matrix by using two-port VNA (vector network analyzer) measurements for 8b/10b encoded, 25Gb/s (bandwidth: 0.125GHz to 1.25GHz) data transfer applications. The results for the loss and jitter characteristics associated with the various components for implementation of low-cost high-speed serial links with FR4 hoard material are illustrated.

引用

页码：387 / 391

页数：5

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