The impact of agglomerates on the chemical mechanical polishing (CMP) of wafer surfaces with colloidal slurries

被引：0
|
作者：
Kuntzsch, T [1 ]
Stintz, M [1 ]
Witnik, U [1 ]
机构：
[1] Tech Univ Dresden, Inst Verfahrenstech & Umwelttech, D-8027 Dresden, Germany
来源：
NANOFAIR 2003: NEW IDEAS FOR INDUSTRY | 2003年 / 1803卷
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中图分类号：
T [工业技术];
学科分类号：
08 ;
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页码：103 / 108
页数：6
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