共 50 条
- [41] Modeling Multilayer Power/Ground Planes in Printed Circuit Boards and Electronic Packages Using Microwave Networks PROCEEDINGS OF THE 2012 IEEE 14TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, 2012, : 637 - 640
- [43] Delay Extraction-Based Modeling Using Loewner Matrix Framework IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2017, 7 (03): : 424 - 433
- [44] Impedance Calculation of Power and Ground Planes by Using Imaging Methods 2012 ASIA-PACIFIC INTERNATIONAL SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY (APEMC), 2012, : 37 - 40
- [47] An Efficient Detector for the Key Components of the Power Transmission Lines 2020 IEEE 32ND INTERNATIONAL CONFERENCE ON TOOLS WITH ARTIFICIAL INTELLIGENCE (ICTAI), 2020, : 898 - 904
- [48] Efficient Modeling of a Small Circular Loop Coupling to Multi-conductor Transmission Lines above a PEC Ground 2016 IEEE ANTENNAS AND PROPAGATION SOCIETY INTERNATIONAL SYMPOSIUM, 2016, : 1977 - 1978
- [49] Equivalent Circuit Modeling of Multilayered Power/Ground Planes for Fast Transient Simulation 2010 DESIGN, AUTOMATION & TEST IN EUROPE (DATE 2010), 2010, : 1153 - 1158