Packaging barrier films deposited on PET by PECVD using a new high density plasma source

被引：48

作者：

Madocks, J ^{[1
]}

Rewhinkle, J ^{[1
]}

Barton, L ^{[1
]}

机构：

[1] Appl Proc Technol Inc, Tucson, AZ 85713 USA

来源：

MATERIALS SCIENCE AND ENGINEERING B-SOLID STATE MATERIALS FOR ADVANCED TECHNOLOGY | 2005年 / 119卷 / 03期

关键词：

PECVD; barrier film; roll to roll; high density plasma; SiOx coatings;

D O I：

10.1016/j.mseb.2004.12.080

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Barrier films for packaging applications are deposited by plasma enhanced chemical vapor deposition (PECVD) on PET film using a new, high density plasma source. The new source, termed the Penning Discharge Plasma source, implements a novel magnetic field/electrode configuration that confines the electron Hall current in an endless loop adjacent to the substrate. By confining the Hall current, a dense, uniform plasma is created and sustained over wide substrates. The result is high rate deposition at low substrate temperatures. The water vapor permeation Of SiO2 barrier films is reported as well as deposition rate, coating thickness and other film properties. © 2005 Elsevier B.V. All rights reserved.

引用

页码：268 / 273

页数：6