ArF excimer laser lithography with bottom antireflective coating

被引:8
|
作者
Kishimura, S [1 ]
Takahashi, M [1 ]
Nakazawa, K [1 ]
Ohfuji, T [1 ]
Sasago, M [1 ]
Uematsu, M [1 ]
Ogawa, T [1 ]
Ohtsuka, H [1 ]
机构
[1] Assoc Superadv Elect Technol, Yokohama Res Ctr, Totsuka Ku, Yokohama, Kanagawa 2440817, Japan
来源
OPTICAL MICROLITHOGRAPHY XI | 1998年 / 3334卷
关键词
ArF excimer laser lithography; bottom antireflective coating; 193; nm; refractive index; chemically amplified resist; substrate dependency; hydrogenated silicon oxynitride; critical dimension variations; gate structure; dry etching;
D O I
10.1117/12.310760
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
In ArF excimer laser lithography, the bottom antireflective coating (BARC) technique is essential in inhibiting the effect of interference and reflective notching. We investigated the antireflective effect of commercially available organic BARCs, that had originally been designed for KrF and i-line lithography, and also the patterning characteristics of ArF resists with BARCs. The refractive indices of various materials were measured with a spectroscopic ellipsometer. The real part (n) and the imaginary part (k) of the complex refractive index at 193 nm were 1.4 similar to 1.7 and 0.1 similar to 0.8, respectively. Almost all the materials had sufficient antireflectivity at 193 nm. We investigated the patterning characteristics of chemically amplified ArF positive resists with suitable BARC materials. The resolution, the depth-of-focus of patterns below 0.16 mu m lines and spaces, and the exposure latitude were improved and good critical dimensional control over topography was achieved by using BARC. An acceptable profile after gale structure (BARC, W-Si, and Poly-Si) etching could be obtained under the typical etching conditions used for KrF resists.
引用
收藏
页码:310 / 321
页数:4
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