Nickel-tin transient liquid phase (TLP) wafer bonding for MEMS vacuum packaging

被引：0
作者：
Welch, W. C., III [1 ]
Najafi, K. [1 ]
机构：
[1] Univ Michigan, WIMS, Ann Arbor, MI 48109 USA
来源：
TRANSDUCERS '07 & EUROSENSORS XXI, DIGEST OF TECHNICAL PAPERS, VOLS 1 AND 2 | 2007年
关键词：
transient liquid phase; diffusion soldering; solder; MEMS packaging; vacuum packaging; wafer bonding;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
This paper reports vacuum data for nickel-tin transient liquid phase (TLP) wafer bonding. Two wafers, one with a titanium getter and another with Pirani vacuum sensors, were bonded for 1.5 hours at 300 degrees C. Initial pressures were as low as 200 mTorr and have remained stable for half a month. After several days, some of the packages were heated to 400 degrees C for 10 minutes to test the thermal integrity of the TLP bond. The bond remained intact; the pressure inside each of the cavities dropped by further activating the getter and has remained steady at the new lower pressure for several weeks.
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页数：1
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