Construction and Application of Electro-Thermal Co-simulation Platform

被引：2

作者：

Pan, Zhengwei ^{[1
,2
]}

Luo, Jian ^{[1
,2
]}

Dong, Changcheng ^{[1
,2
]}

Liu, Xuguang ^{[1
,2
]}

Wang, Rui ^{[1
,2
]}

Yao, Erxian ^{[1
,2
]}

机构：

[1] Nari Grp Corp, Nanjing, Peoples R China

[2] NARI GEIRI Power Semicond Co Ltd, Nanjing, Peoples R China

来源：

2020 IEEE 2ND INTERNATIONAL CONFERENCE ON CIRCUITS AND SYSTEMS (ICCS 2020) | 2020年

关键词：

electro-thermal; reduced ordered model; dynamic characteristic package model; MODEL;

D O I：

10.1109/ICCS51219.2020.9336616

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

This paper introduces the construction and application of the electro-thermal co-simulation platform. Based on the finite element method, we first established a device-level simulation model of IGBT and diode with dynamic characteristics; at the same time, we extracted the corresponding network model through CFD simulation calculation of the transient operating conditions of the IGBT device; then, using 1200V 600A IGBT as an example to build a complete electro-thermal co-simulation platform; finally, the simulation data of the electro-thermal co-simulation platform and the test data of the developed 1200V 600A device are tested and verified under the same working conditions.

引用

页码：15 / 19

页数：5

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