Construction and Application of Electro-Thermal Co-simulation Platform

被引：2
作者：
Pan, Zhengwei [1 ,2 ]
Luo, Jian [1 ,2 ]
Dong, Changcheng [1 ,2 ]
Liu, Xuguang [1 ,2 ]
Wang, Rui [1 ,2 ]
Yao, Erxian [1 ,2 ]
机构：
[1] Nari Grp Corp, Nanjing, Peoples R China
[2] NARI GEIRI Power Semicond Co Ltd, Nanjing, Peoples R China
来源：
2020 IEEE 2ND INTERNATIONAL CONFERENCE ON CIRCUITS AND SYSTEMS (ICCS 2020) | 2020年
关键词：
electro-thermal; reduced ordered model; dynamic characteristic package model; MODEL;
D O I：
10.1109/ICCS51219.2020.9336616
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
This paper introduces the construction and application of the electro-thermal co-simulation platform. Based on the finite element method, we first established a device-level simulation model of IGBT and diode with dynamic characteristics; at the same time, we extracted the corresponding network model through CFD simulation calculation of the transient operating conditions of the IGBT device; then, using 1200V 600A IGBT as an example to build a complete electro-thermal co-simulation platform; finally, the simulation data of the electro-thermal co-simulation platform and the test data of the developed 1200V 600A device are tested and verified under the same working conditions.
引用
收藏
页码：15 / 19
页数：5
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