TXRF applications supporting yield enhancements and tool monitoring in order to improve the front-end semiconductor processing

被引：0

作者：

Budd, Thanas ^{[1
]}

机构：

[1] Natl Semicond Corp, Portland, ME 04106 USA

来源：

2008 IEEE/SEMI ADVANCED SEMICONDUCTOR MANUFACTURING CONFERENCE | 2008年

关键词：

TXRF; SIMS; ToF-SIMS; contamination;

D O I：

10.1109/ASMC.2008.4529056

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

In this paper, we summarize how the introduction of in-line TXRF monitoring provides detailed analytical information on aluminum, titanium and molybdenum contamination levels in order to improve several process steps from front-end processing, minimize product yield loss and make it possible to successfully manufacture multiple products and process geometries in the same fabrication platform.

引用

页码：292 / 296

页数：5