Enhanced adhesion with pedestal-shaped elastomeric stamps for transfer printing

被引:46
作者
Kim, Seok [1 ]
Carlson, Andrew [1 ]
Cheng, Huanyu [2 ]
Lee, Seungwoo [3 ]
Park, Jung-Ki [3 ]
Huang, Yonggang [2 ]
Rogers, John A. [1 ]
机构
[1] Univ Illinois, Dept Mat Sci & Engn, Urbana, IL 61801 USA
[2] Northwestern Univ, Dept Civil & Environm Engn, Dept Mech Engn, Evanston, IL 61208 USA
[3] Korea Adv Inst Sci & Technol, Dept Chem & Biomol Engn, Taejon 305701, South Korea
基金
美国国家科学基金会;
关键词
SURFACES; SEMITRANSPARENT; ELECTRONICS; TRANSISTORS;
D O I
10.1063/1.4706257
中图分类号
O59 [应用物理学];
学科分类号
摘要
Microscale elastomeric relief structures with "pedestal" shapes provide enhanced operation in stamps designed for deterministic materials assembly via transfer printing. Experimental measurements of adhesion and finite element analysis both show that for certain geometries, exceptionally large enhancements in adhesion strength (over 15x) can be achieved. Transfer printing of microscale platelets of silicon and ultrathin gallium nitride light emitting diodes onto a silicon substrate without adhesive coatings demonstrates some capabilities in assembly that result from this type of stamp, of interest in diverse applications, including those that involve heterogeneous materials integration. (C) 2012 American Institute of Physics. [http://dx.doi.org/10.1063/1.4706257]
引用
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页数:4
相关论文
共 26 条
[1]   Origin of the superior adhesive performance of mushroom-shaped microstructured surfaces [J].
Carbone, Giuseppe ;
Pierro, Elena ;
Gorb, Stanislav N. .
SOFT MATTER, 2011, 7 (12) :5545-5552
[2]   Shear-enhanced adhesiveless transfer printing for use in deterministic materials assembly [J].
Carlson, Andrew ;
Kim-Lee, Hyun-Joon ;
Wu, Jian ;
Elvikis, Paulius ;
Cheng, Huanyu ;
Kovalsky, Anton ;
Elgan, Steven ;
Yu, Qingmin ;
Ferreira, Placid M. ;
Huang, Yonggang ;
Turner, Kevin T. ;
Rogers, John A. .
APPLIED PHYSICS LETTERS, 2011, 98 (26)
[3]   Toward the Development of Printable Nanowire Electronics and Sensors [J].
Fan, Zhiyong ;
Ho, Johnny C. ;
Takahashi, Toshitake ;
Yerushalmi, Roie ;
Takei, Kuniharu ;
Ford, Alexandra C. ;
Chueh, Yu-Lun ;
Javey, Ali .
ADVANCED MATERIALS, 2009, 21 (37) :3730-3743
[4]   Strain engineering of epitaxially transferred, ultrathin layers of III-V semiconductor on insulator [J].
Fang, Hui ;
Madsen, Morten ;
Carraro, Carlo ;
Takei, Kuniharu ;
Kim, Ha Sul ;
Plis, Elena ;
Chen, Szu-Ying ;
Krishna, Sanjay ;
Chueh, Yu-Lun ;
Maboudian, Roya ;
Javey, Ali .
APPLIED PHYSICS LETTERS, 2011, 98 (01)
[5]   Biomimetic mushroom-shaped fibrillar adhesive microstructure [J].
Gorb, S. ;
Varenberg, M. ;
Peressadko, A. ;
Tuma, J. .
JOURNAL OF THE ROYAL SOCIETY INTERFACE, 2007, 4 (13) :271-275
[6]   Biological functionalization of massively parallel arrays of nanocantilevers using microcontact printing [J].
Guillon, S. ;
Salomon, S. ;
Seichepine, F. ;
Dezest, D. ;
Mathieu, F. ;
Bouchier, A. ;
Mazenq, L. ;
Thibault, C. ;
Vieu, C. ;
Leichle, T. ;
Nicu, L. .
SENSORS AND ACTUATORS B-CHEMICAL, 2012, 161 (01) :1135-1138
[7]   A nontransferring dry adhesive with hierarchical polymer nanohairs [J].
Jeong, Hoon Eui ;
Lee, Jin-Kwan ;
Kim, Hong Nam ;
Moon, Sang Heup ;
Suh, Kahp Y. .
PROCEEDINGS OF THE NATIONAL ACADEMY OF SCIENCES OF THE UNITED STATES OF AMERICA, 2009, 106 (14) :5639-5644
[8]   Unusual strategies for using indium gallium nitride grown on silicon (111) for solid-state lighting [J].
Kim, Hoon-sik ;
Brueckner, Eric ;
Song, Jizhou ;
Li, Yuhang ;
Kim, Seok ;
Lu, Chaofeng ;
Sulkin, Joshua ;
Choquette, Kent ;
Huang, Yonggang ;
Nuzzo, Ralph G. ;
Rogers, John A. .
PROCEEDINGS OF THE NATIONAL ACADEMY OF SCIENCES OF THE UNITED STATES OF AMERICA, 2011, 108 (25) :10072-10077
[9]   Electrically interconnected assemblies of microscale device components by printing and molding [J].
Kim, Mo Joon ;
Yoon, Jongseung ;
Park, Sang-Il ;
Rogers, John A. .
APPLIED PHYSICS LETTERS, 2009, 95 (21)
[10]   Biologically inspired polymer microfibers with spatulate tips as repeatable fibrillar adhesives [J].
Kim, Seok ;
Sitti, Metin .
APPLIED PHYSICS LETTERS, 2006, 89 (26)