Full densification of inkjet-printed copper conductive tracks on a flexible substrate utilizing a hydrogen plasma sintering

被引：36

作者：

Kwon, Young-Tae ^{[1
]}

Lee, Young-In ^{[2
]}

Kim, Seil ^{[1
]}

Lee, Kun-Jae ^{[3
]}

Choa, Yong-Ho ^{[1
]}

机构：

[1] Hanyang Univ, Dept Fus Chem Engn, Ansan 15588, South Korea

[2] Seoul Natl Univ Sci & Technol, Dept Mat Sci & Engn, Seoul 01811, South Korea

[3] Dankook Univ, Dept Energy Engn, Cheonan 31116, South Korea

来源：

APPLIED SURFACE SCIENCE | 2017年 / 396卷

关键词：

Inkjet printing; Copper conductive tracks; Full densification; Plasma sintering; Flexible substrates; POLYMER; ELECTRONICS; FILMS;

D O I：

10.1016/j.apsusc.2016.11.122

中图分类号：

O64 [物理化学（理论化学）、化学物理学];

学科分类号：

070304 ; 081704 ;

摘要：

Low temperature sintering techniques are crucial in developing flexible printed electronics. In this work, we demonstrate a novel hydrogen plasma sintering method that achieves a full reduction and densification of inkjet-printed patterns using a copper complex ion ink. After inkjet printing on polyethylene terephthalate (PET) substrates, both hydrogen plasma and conventional hydrogen thermal treatment were employed to compare the resulting microstructures, electrical properties and anti-oxidation behavior. The plasma treated pattern shows a fully densified microstructure with a resistivity of 3.23 mu Omega cm, while the thermally treated pattern shows a relatively poor microstructure and high resistivity. In addition, the hydrogen plasma-treated copper pattern retains its electrical resistivity for one month without any significant decrease. This novel hydrogen plasma sintering technique could be used to produce conductive patterns with excellent electrical properties, allowing for highly reliable flexible printed electronics. (C) 2016 Elsevier B.V. All rights reserved.

引用

页码：1239 / 1244

页数：6

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