Phase-change properties of GeSbTe thin films deposited by plasma-enchanced atomic layer depositon

被引:27
作者
Song, Sannian [1 ]
Yao, Dongning [1 ]
Song, Zhitang [1 ]
Gao, Lina [2 ]
Zhang, Zhonghua [1 ]
Li, Le [1 ]
Shen, Lanlan [1 ]
Wu, Liangcai [1 ]
Liu, Bo [1 ]
Cheng, Yan [1 ]
Feng, Songlin [1 ]
机构
[1] Chinese Acad Sci, State Key Lab Funct Mat Informat, Shanghai Inst Microsyst & Informat Technol, Shanghai 200050, Peoples R China
[2] Chinese Acad Sci, Shanghai Inst Appl Phys, Div Nucl Mat Sci & Engn, Shanghai 201800, Peoples R China
来源
NANOSCALE RESEARCH LETTERS | 2015年 / 10卷
基金
中国国家自然科学基金;
关键词
Phase-change memory; Atomic layer deposition; Microstructure; Electric properties; CHEMICAL-VAPOR-DEPOSITION;
D O I
10.1186/s11671-015-0815-5
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
Phase-change access memory (PCM) appears to be the strongest candidate for next-generation high-density nonvolatile memory. The fabrication of ultrahigh-density PCM depends heavily on the thin-film growth technique for the phase-changing chalcogenide material. In this study, Ge2Sb2Te5 (GST) and GeSb8Te thin films were deposited by plasma-enhanced atomic layer deposition (ALD) method using Ge [(CH3)(2) N](4), Sb [(CH3)(2) N](3), Te(C4H9)(2) as precursors and plasma-activated H-2 gas as reducing agent of the metallorganic precursors. Compared with GST-based device, GeSb8Te-based device exhibits a faster switching speed and reduced reset voltage, which is attributed to the growth-dominated crystallization mechanism of the Sb-rich GeSb8Te films. These results show that ALD is an attractive method for preparation of phase-change materials.
引用
收藏
页码:1 / 5
页数:5
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