HEAT SINK WITH MULTILAYER OF POROUS MEDIA

This study presents a new miniature porous heat sink system for dissipating high heat flux in electronic devices. Previous studies have shown that stacked multilayer mini/micro channel heat sinks have advantages over traditional single layered channels in terms of both pressure drop and thermal resistance. Instead of square or rectangular channels, in this work, a stacked multilayer of porous media is used, where the porosity varies from one layer to the next layer (porosity scaling) along with the heat transfer direction. This work studies numerically both the pressure drop and thermal resistance for the proposed approach. The results are compared with the case of uniform porosities and also with the case when layers of a multichannel are used instead of porous media layers.