Percolative Model and Thermodynamic Analysis of Oxygen-Ion-Mediated Resistive Switching

被引:20
作者
Raghavan, Nagarajan [1 ]
Pey, Kin Leong [2 ]
Wu, Xing [2 ]
Liu, Wenhu [1 ]
Bosman, Michel [3 ]
机构
[1] Nanyang Technol Univ, Sch Elect & Elect Engn, Div Microelect, Singapore 639798, Singapore
[2] Singapore Univ Technol & Design, Singapore 138682, Singapore
[3] ASTAR, Inst Mat Res & Engn, Singapore 117602, Singapore
关键词
Oxygen vacancy; percolation model; read voltage; reliability; resistive switching; soft breakdown (SBD); HIGH-K;
D O I
10.1109/LED.2012.2187170
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
We present a statistical percolation model for retention lifetime assessment of resistive switching memory at the high-resistance state and correlate it to the soft breakdown phenomenon in ultrathin gate dielectrics. Electrical characterization in the low-resistance state shows that the location of oxygen-vacancy-based conductive filaments is almost randomly distributed and the trap generation rate across the oxide after reset transition is uniform. The constraints for the range of read voltages in the low and high conduction states, governed by the area of the device and the thermodynamics of oxygen ion transport, are presented.
引用
收藏
页码:712 / 714
页数:3
相关论文
共 11 条
[1]  
[Anonymous], P INT REL PHYS S
[2]  
Degraeve R., 2001, IEEE Transactions on Device and Materials Reliability, V1, P163, DOI 10.1109/7298.974832
[3]  
Degraeve R., 2010, IEDM, P2841
[4]   Reliability screening of high-k dielectrics based on voltage ramp stress [J].
Kerber, A. ;
Pantisano, L. ;
Veloso, A. ;
Groeseneken, G. ;
Kerber, M. .
MICROELECTRONICS RELIABILITY, 2007, 47 (4-5) :513-517
[5]   Reliability characteristics of high-k, dielectrics [J].
Kim, YH ;
Lee, JC .
MICROELECTRONICS RELIABILITY, 2004, 44 (02) :183-193
[6]   The interaction of oxygen vacancies with grain boundaries in monoclinic HfO2 [J].
McKenna, Keith ;
Shluger, Alexander .
APPLIED PHYSICS LETTERS, 2009, 95 (22)
[7]   Quantum mechanical treatment of Si-O bond breakage in silica under time dependent dielectric breakdown testing [J].
McPherson, J. W. .
2007 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM PROCEEDINGS - 45TH ANNUAL, 2007, :209-216
[8]   Very Low Reset Current for an RRAM Device Achieved in the Oxygen-Vacancy-Controlled Regime [J].
Raghavan, N. ;
Pey, K. L. ;
Li, X. ;
Liu, W. H. ;
Wu, X. ;
Bosman, M. ;
Kauerauf, T. .
IEEE ELECTRON DEVICE LETTERS, 2011, 32 (06) :716-718
[9]   Modified Percolation Model for Polycrystalline High-K Gate Stack With Grain Boundary Defects [J].
Raghavan, Nagarajan ;
Pey, Kin Leong ;
Shubhakar, Kalya ;
Bosman, Michel .
IEEE ELECTRON DEVICE LETTERS, 2011, 32 (01) :78-80
[10]   Exponential ionic drift: fast switching and low volatility of thin-film memristors [J].
Strukov, Dmitri B. ;
Williams, R. Stanley .
APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING, 2009, 94 (03) :515-519