Advanced packaging: The redistributed chip package

被引：28

作者：

Keser, Beth ^{[1
]}

Amrine, Craig ^{[1
]}

Duong, Trung ^{[1
]}

Hayes, Scott ^{[1
]}

Leal, George ^{[1
]}

Lytle, William ^{[1
]}

Mitchell, Doug ^{[1
]}

Wenzel, Robert ^{[1
]}

机构：

[1] Freescale Semicond, Tempe, AZ 85284 USA

来源：

IEEE TRANSACTIONS ON ADVANCED PACKAGING | 2008年 / 31卷 / 01期

关键词：

advanced packaging; dielectric material; electronic packaging; redistribution;

D O I：

10.1109/TADVP.2007.909456

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

The redistributed chip package (RCP) is a substrateless embedded chip package that offers a low-cost, high performance, integrated alternative to current wirebond ball grid array (BGA) and flip chip BGA packaging. Devices are encapsulated into panels while routing of signals, power, and ground is built directly on the panel. The RCP panel and signal buildup lowers the cost of the package by eliminating wafer bumping and substrates thereby enabling large scale assembly in panel form. The buildup provides better routing capabilities and better integration. Also, by eliminating bumping, the device interconnect is inherently Pb-free, and the stress of the package is reduced enabling ultra-low-k device compatibility. The panel is created by attaching the device active side down to a substrate, encapsulating and curing the devices, grinding to desired thickness, and then removing the substrate. Signal, power, and ground planes are created using redistribution-like processing. Multilayer metal RCP packages have passed -40 to 125 C air-to-air thermal cycling and HAST after MSL3/260 preconditioning.

引用

页码：39 / 43

页数：5

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