Thermo-mechanical reliability of microcomponents

被引：0

作者：

Dudek, R ^{[1
]}

Schubert, A ^{[1
]}

Michel, B ^{[1
]}

机构：

[1] Fraunhofer Inst Zuverlassigkeit & Mikrointegrat I, D-13355 Berlin, Germany

来源：

MICRO MATERIALS, PROCEEDINGS | 2000年

关键词：

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Computer based thermo-mechanical design and performance optimization are in widespread use. They are mainly based on finite element (FE-) analyses. Applications of the method in performing parametric studies on the thermomechanical behavior of different flip chip assemblies are given. The underfill materials are varied. Fatigue failure limits are estimated for both not underfilled and underfilled assemblies with small dies. Underfill materials with different characteristics, ranging from stiff to soft, are treated.

引用

页码：206 / 213

页数：8