Evolution of Voids in Mg/Al Diffusion Bonding Process

被引：7
作者：
Long, Luping [1 ]
Liu, Wensheng [1 ]
Ma, Yunzhu [1 ]
Wu, Lei [1 ]
Tang, Siwei [1 ]
机构：
[1] Cent S Univ, State Key Lab Powder Met, Changsha 410083, Hunan, Peoples R China
来源：
HIGH TEMPERATURE MATERIALS AND PROCESSES | 2017年 / 36卷 / 10期
基金：
国家高技术研究发展计划(863计划);
关键词：
diffusion bonding; void behaviors; plastic deformation; stresses; diffusion; MAGNESIUM; ALLOYS; MG; AL; MICROSTRUCTURE; JOINTS;
D O I：
10.1515/htmp-2016-0024
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
The closure process of voids was very crucial for diffusion bonding, voids behaviors in Mg/Al bonding process were investigated, and the control mechanisms of diffusion at different predominant process parameters were discussed in this paper. Finite element simulation was utilized to investigate the influence of thermal residual stresses on the appearance of secondary voids. The results showed that: the dominant mechanism of void closure was plastic deformation in the initial stage of Mg/Al diffusion bonding. Numerical results indicated that secondary voids could be easily generated in the regions where tensile residual stress gradient achieves the maximum, corresponding to area that Al3Mg2 layer at the nearby Al/Al3Mg2 interface, the segregation of voids deteriorated the performances of the bonded joints.
引用
收藏
页码：985 / 992
页数：8
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