Fast Eye Diagram Determination for the Signal Integrity Verification of Frequency-Variant Transmission Lines

被引：2

作者：

Kim, Hyunsik ^{[1
]}

Kim, Dongchul ^{[1
]}

Eo, Yungseon ^{[1
]}

机构：

[1] Hanyang Univ, Dept Elect & Comp Eng, Ansan, South Korea

来源：

2009 INTERNATIONAL SOC DESIGN CONFERENCE (ISOCC 2009) | 2009年

关键词：

Eye-diagram; frequency-variant characteristics; signal integrity; signal transient response; transmission line;

D O I：

10.1109/SOCDC.2009.5423860

中图分类号：

TP3 [计算技术、计算机技术];

学科分类号：

0812 ;

摘要：

A new efficient and accurate eye diagram determination technique is presented. In order to estimate the worst case eye diagram, bit streams which may induce the worst ISI (inter symbol interference) are determined. Then the output responses for worst case bit streams are determined by using fast Fourier transform technique. The proposed technique is compared with SPICE simulation that employs PRBS (pseudo-random bit sequence) input signals.

引用

页码：436 / 439

页数：4

共 13 条

[1]

[Anonymous], HFSS

[2]

BOHR M, 2009, P IEEE INT SOL STAT, P23, DOI DOI 10.1109/ISSCC.2009.4977293

[3] Predicting Microwave Digital Signal Integrity [J].

Buckwalter, James F. .

IEEE TRANSACTIONS ON ADVANCED PACKAGING, 2009, 32 (02) :280-289

[4] GENERALIZED COUPLED INTERCONNECT TRANSFER-FUNCTION AND HIGH-SPEED SIGNAL SIMULATIONS [J].

EO, Y ;

EISENSTADT, WR .

IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 1995, 43 (05) :1115-1121

[5]

Fjelstad J, 2005, CIRCUIT WORLD, V31, P25, DOI 10.1108/03056120510603116

[6] Fast Methodology for Determining Eye Diagram Characteristics of Lossy Transmission Lines [J].

Guo, Wei-Da ;

Lin, Jeng-Hau ;

Lin, Chien-Min ;

Huang, Tian-Wei ;

Wu, Ruey-Beei .

IEEE TRANSACTIONS ON ADVANCED PACKAGING, 2009, 32 (01) :175-183

[7] Analytical Eye-Diagram Model for On-Chip Distortionless Transmission Lines and Its Application to Design Space Exploration [J].

Hashimoto, Masanori ;

Siriporn, Jangsombatsiri ;

Tsuchiya, Akira ;

Zhu, Haikun ;

Cheng, Chung-Kuan .

IEICE TRANSACTIONS ON FUNDAMENTALS OF ELECTRONICS COMMUNICATIONS AND COMPUTER SCIENCES, 2008, E91A (12) :3474-3480

[8]

*ITRS, 2007, SIA REP

[9] Three-dimensional silicon integration [J].

Knickerbocker, J. U. ;

Andry, P. S. ;

Dang, B. ;

Horton, R. R. ;

Interrante, M. J. ;

Patel, C. S. ;

Polastre, R. J. ;

Sakuma, K. ;

Sirdeshmukh, R. ;

Sprogis, E. J. ;

Sri-Jayantha, S. M. ;

Stephens, A. M. ;

Topol, A. W. ;

Tsang, C. K. ;

Webb, B. C. ;

Wright, S. L. .

IBM JOURNAL OF RESEARCH AND DEVELOPMENT, 2008, 52 (06) :553-569

[10]

MathWorks, Matlab

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