A high performance plasma display panel driver IC using SOI
被引:21
作者:
Sumida, H
论文数: 0引用数: 0
h-index: 0
机构:
Fuji Elect Co Ltd, Matsumoto, Nagano 3900821, JapanFuji Elect Co Ltd, Matsumoto, Nagano 3900821, Japan
Sumida, H
[1
]
Hirabayashi, A
论文数: 0引用数: 0
h-index: 0
机构:
Fuji Elect Co Ltd, Matsumoto, Nagano 3900821, JapanFuji Elect Co Ltd, Matsumoto, Nagano 3900821, Japan
Hirabayashi, A
[1
]
Shimabukuro, H
论文数: 0引用数: 0
h-index: 0
机构:
Fuji Elect Co Ltd, Matsumoto, Nagano 3900821, JapanFuji Elect Co Ltd, Matsumoto, Nagano 3900821, Japan
Shimabukuro, H
[1
]
Takazawa, Y
论文数: 0引用数: 0
h-index: 0
机构:
Fuji Elect Co Ltd, Matsumoto, Nagano 3900821, JapanFuji Elect Co Ltd, Matsumoto, Nagano 3900821, Japan
Takazawa, Y
[1
]
Shigeta, Y
论文数: 0引用数: 0
h-index: 0
机构:
Fuji Elect Co Ltd, Matsumoto, Nagano 3900821, JapanFuji Elect Co Ltd, Matsumoto, Nagano 3900821, Japan
Shigeta, Y
[1
]
机构:
[1] Fuji Elect Co Ltd, Matsumoto, Nagano 3900821, Japan
来源:
ISPSD '98 - PROCEEDINGS OF THE 10TH INTERNATIONAL SYMPOSIUM ON POWER SEMICONDUCTOR DEVICES & ICS
|
1998年
关键词:
D O I:
10.1109/ISPSD.1998.702654
中图分类号:
TM [电工技术];
TN [电子技术、通信技术];
学科分类号:
0808 ;
0809 ;
摘要:
In this paper we demonstrate an advanced 200V-class plasma display panel scan driver IC using dielectric isolation, that utilizes bonded SOI and trench isolation, and a lateral IGBT (LIGBT). We have accomplished a large reduction in chip size compared with the IC fabricated on a junction isolated wafer and have obtained good output characteristics by optimizing device parameters. Moreover, original techniques to improve the blocking capability of the integrated LIGBT and lateral p-channel MOSFET have been included in our fabricated IC and are also described in this papaer.