Enhancement in piezoelectric responses of AlN thin films by co-addition of Mg and Ta

被引:5
|
作者
Anggraini, Sri Ayu [1 ]
Uehara, Masato [1 ]
Hirata, Kenji [1 ]
Yamada, Hiroshi [1 ]
Akiyama, Morito [1 ]
机构
[1] Natl Inst Adv Ind Sci & Technol, Sensing Syst Res Ctr SSRC, Kyushu Ctr, 807-1 Shukumachi, Tosu, Saga, Japan
关键词
AlN; Piezoelectricity; Thin film; Sputtering; Magnesium; Tantalum; MICROSTRUCTURE; ZR; TI;
D O I
10.1016/j.matchemphys.2021.125394
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
The piezoelectric charge coefficient (d(33)) of aluminum nitride (AlN) was successfully increased by co-addition of magnesium (Mg) and tantalum (Ta). While addition of either Mg or Ta as a single dopant only slightly enhanced the d(33), greater d(33) can be obtained when 24 at.% MgTa was alloyed with AlN at Mg to Ta ratio approximate to 3. The highest d(33) value was found to be 10.4 pC/N for (MgTa)(0.24)Al0.76N, which is a 73% increase from that of AlN. Our study also revealed how addition of Mg and/or Ta could affect the crystallinity of the thin films and eventually the corresponding d(33).
引用
收藏
页数:6
相关论文
共 50 条
  • [21] Influence of oxygen and argon on the crystal quality and piezoelectric response of AlN sputtered thin films
    Vergara, L
    Clement, M
    Iborra, E
    Sanz-Hervás, A
    García-López, J
    Morilla, Y
    Sangrador, J
    Respaldiza, MA
    DIAMOND AND RELATED MATERIALS, 2004, 13 (4-8) : 839 - 842
  • [22] Ni-V(or Cr) Co-addition Cu alloy films with high stability and low resistivity
    Zheng, Y. H.
    Li, X. N.
    Cheng, X. T.
    Sun, W.
    Liu, M.
    Liu, Y. B.
    Wang, M.
    Dong, C.
    MATERIALS CHEMISTRY AND PHYSICS, 2018, 205 : 253 - 260
  • [23] Controllable Ag/Ta ratios of co-implanted TiN films on titanium alloys for osteogenic enhancement and antibacterial responses
    Song, Xiduo
    Zhao, Mengli
    Li, Dejun
    SURFACE & COATINGS TECHNOLOGY, 2022, 436
  • [24] Piezoelectric and electroacoustic properties of Ti-doped AlN thin films as a function of Ti content
    Iborra, Enrique
    Capilla, Jose
    Olivares, Jimena
    Clement, Marta
    Felmetsger, Valeriy
    2012 IEEE INTERNATIONAL ULTRASONICS SYMPOSIUM (IUS), 2012, : 2734 - 2737
  • [25] The effect of low energy helium implantation on the structural, vibrational, and piezoelectric properties of AlN thin films
    Sharma, V.
    Natali, F.
    Kennedy, J.
    Leveneur, J.
    Fiedler, H.
    Murmu, P.
    Williams, G. V. M.
    PHYSICA B-CONDENSED MATTER, 2021, 601
  • [26] Unexpected effects on creep resistance of an extruded Mg-Bi alloy by Zn and Ca co-addition: Experimental studies and first-principles calculations
    Xiao, Zhenyu
    Xu, Shiwei
    Huang, Weiying
    Liu, Haifeng
    Yang, Xuyue
    Xu, Haikun
    Ma, Chao
    Jin, Chen
    Lin, Zhanhong
    JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, 2024, 201 : 166 - 186
  • [27] Surface Morphology and Microstructure of Pulsed DC Magnetron Sputtered Piezoelectric AlN and AlScN Thin Films
    Lu, Yuan
    Reusch, Markus
    Kurz, Nicolas
    Ding, Anli
    Christoph, Tim
    Kirste, Lutz
    Lebedev, Vadim
    Zukauskaite, Agne
    PHYSICA STATUS SOLIDI A-APPLICATIONS AND MATERIALS SCIENCE, 2018, 215 (09):
  • [28] Effects of Cu and Ce co-addition on the microstructure and mechanical properties of Mg-6Zn-0.5Zr alloy
    He, M. L.
    Luo, T. J.
    Liu, Y. T.
    Lin, T.
    Zhou, J. X.
    Yang, Y. S.
    JOURNAL OF ALLOYS AND COMPOUNDS, 2018, 767 : 1216 - 1224
  • [29] Achieving preeminent strength-ductility synergy of Mg-1Sb-1Mn alloy via trace co-addition of Sn and Zn
    Liu, Lintao
    Bai, Shengwen
    Jiang, Bin
    He, Chao
    Wang, Qinghang
    Zhou, Jianxin
    Wei, Liping
    Qian, Xiaoying
    Dong, Zhihua
    Huang, Guangsheng
    Zhang, Dingfei
    Pan, Fusheng
    MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2023, 862
  • [30] Large Piezoelectric Response and Ferroelectricity in Li and V/Nb/Ta Co-Doped w-AlN
    Noor-A-Alam, Mohammad
    Olszewski, Oskar Z.
    Campanella, Humberto
    Nolan, Michael
    ACS APPLIED MATERIALS & INTERFACES, 2021, 13 (01) : 944 - 954