Low frequency noise in Schottky barrier contacts of titanium nitride on n-type silicon

被引:12
作者
Farmakis, FV
Brini, J
Mathieu, N
Kamarinos, G
Dimitriadis, CA
Logothetidis, S
机构
[1] ENSERG, Lab Phys Composants Semicond, F-38016 Grenoble, France
[2] Univ Thessaloniki, Dept Phys, GR-54006 Salonika, Greece
关键词
D O I
10.1088/0268-1242/13/11/009
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
The electrical characteristics and the low frequency noise of TiNx Schottky contacts on n-type Si(100) have been systematically measured. The TiNx thin films were deposited by reactive magnetron sputtering at room temperature. Based on a model of a parallel combination of an ideal diode of current I-1 and a generation-recombination diode of current I-2, we have extracted the contribution of both diodes to the measured total current I. Treating the two components I-1 and I-2 as different noise generators, we have analysed the observed white noise at high frequencies and the 1/f excess current noise at lower frequencies. The white noise is explained by using a pure shot noise for the component I-1, by applying Gupta's general theorem on noise in non-linear driven devices for the component I-2 and by considering an additional noise generator with a Nyquist-type intensity. The 1/f excess current noise S-I is explained by a model based on fluctuations of the generation-recombination current I-2 only. Analysis of the S-I versus I data allowed us to determine the interface state density.
引用
收藏
页码:1284 / 1289
页数:6
相关论文
共 15 条
[1]   SCHOTTKY-BARRIER CONTACTS OF TITANIUM NITRIDE ON N-TYPE SILICON [J].
DIMITRIADIS, CA ;
LOGOTHETIDIS, S ;
ALEXANDROU, I .
APPLIED PHYSICS LETTERS, 1995, 66 (04) :502-504
[2]   THERMAL NOISE IN NON-LINEAR RESISTIVE DEVICES AND ITS CIRCUIT REPRESENTATION [J].
GUPTA, MS .
PROCEEDINGS OF THE IEEE, 1982, 70 (08) :788-804
[3]   INFLUENCE OF BARRIER INHOMOGENEITIES ON NOISE AT SCHOTTKY CONTACTS [J].
GUTTLER, HH ;
WERNER, JH .
APPLIED PHYSICS LETTERS, 1990, 56 (12) :1113-1115
[4]   PROPERTIES OF TITANIUM NITRIDE FILMS FOR BARRIER METAL IN ALUMINUM OHMIC CONTACT SYSTEMS [J].
HARA, T ;
YAMANOUE, A ;
IIO, H ;
INOUE, K ;
WASHIDZU, G ;
NAKAMURA, S .
JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, 1991, 30 (07) :1447-1451
[7]   THE EFFECTS OF ION BOMBARDING ENERGY ON THE STRUCTURE AND PROPERTIES OF TIN FILMS SYNTHESIZED BY DUAL-ION BEAM SPUTTERING [J].
LI, WZ ;
HE, XM ;
LI, HD .
JOURNAL OF APPLIED PHYSICS, 1994, 75 (04) :2002-2006
[8]   IN-SITU SPECTROSCOPIC ELLIPSOMETRY TO MONITOR THE PROCESS OF TINX THIN-FILMS DEPOSITED BY REACTIVE SPUTTERING [J].
LOGOTHETIDIS, S ;
ALEXANDROU, I ;
PAPADOPOULOS, A .
JOURNAL OF APPLIED PHYSICS, 1995, 77 (03) :1043-1047
[9]   In-situ and real time room temperature oxidation studies of fcc TiN thin films [J].
Logothetidis, S ;
Barborica, A .
MICROELECTRONIC ENGINEERING, 1997, 33 (1-4) :309-316
[10]   IN-SITU SPECTROSCOPIC ELLIPSOMETRY TO CONTROL THE GROWTH OF TI NITRIDE AND CARBIDE THIN-FILMS [J].
LOGOTHETIDIS, S ;
ALEXANDROU, I ;
STOEMENOS, J .
APPLIED SURFACE SCIENCE, 1995, 86 (1-4) :185-189