Effects of rapid thermal treatments on the electrical properties of thin SiO2 gate oxide for DRAM p-channel MOS transistors

被引:1
作者
Santucci, S [1 ]
Guerrieri, S
Passacantando, M
Picozzi, P
Famà, F
Nardi, N
Basile, F
机构
[1] Univ Aquila, Dept Phys, I-67010 Coppito, AQ, Italy
[2] Univ Aquila, Unita INFM, I-67010 Coppito, AQ, Italy
[3] Micron Technol Italia, I-67051 Avezzano, AQ, Italy
关键词
D O I
10.1016/S0022-3093(00)00388-4
中图分类号
TQ174 [陶瓷工业]; TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
Silicon oxide has been grown by rapid thermal processing. The growth rate, in the range of very thin films (<10 nm), has been studied as a function of the oxidation temperature. Combined films composed by conventional thermal silicon oxide growth over SiO2 passivation layer deposited by rapid thermal processing onto Si(1 0 0) substrates have been used as gate oxide of p-channel metal-oxide semiconductor (p-MOS) transistors of dynamic random access memory (DRAM). The effect of rapid thermal annealing treatments on these films has also been experimented. Improvements in the electrical performances of transistors have been observed. (C) 2001 Elsevier Science B.V. All rights reserved.
引用
收藏
页码:54 / 58
页数:5
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