Thermal Conductivity of Solidified Industrial Copper Matte and Fayalite Slag

被引：5

作者：

Sibarani, David ^{[1
]}

Hamuyuni, Joseph ^{[2
]}

Luomala, Matti ^{[2
]}

Lindgrenid, Mari ^{[2
]}

Jokilaakso, Ari ^{[1
]}

机构：

[1] Aalto Univ, Sch Chem Engn, Dept Chem & Met Engn, Espoo 02150, Finland

[2] Outotec Finland Oy, Res Ctr, Kuparitie 10,POB 69, Pori 28101, Finland

来源：

JOM | 2020年 / 72卷 / 05期

基金：

芬兰科学院;

关键词：

HEAT-CAPACITY; DIFFUSIVITY; SYSTEM; CU2S;

D O I：

10.1007/s11837-020-04072-0

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

The thermal conductivity of various copper matte and fayalite slag was measured using laser flash analysis, a non-steady state measurement method. Industrial matte and slag samples were taken in such a way that their composition represented typical process conditions. Thermal conductivities for solid copper matte (average 64% Cu) were found to be from 1.2 W m(-1) K-1 at 300 degrees C to 2.1 W m(-1) K-1 at 900 degrees C. Because arsenic is one of the most important impurities in copper matte, its effect on thermal conductivity was investigated with As-doped matte samples up to 0.59% As. The results showed substantially lower thermal conductivity, between 0.5 W m(-1) K-1 and 1.3 W m(-1) K-1 at 300-900 degrees C with low As matte, behavior that is analogous to that of a semiconductor. The data obtained showed that the thermal conductivity of copper matte increased linearly with temperature, but the gradient was small. The thermal conductivity of slags was found to be between 1.6 W m(-1) K-1 and 1.9 W m(-1) K-1, values that are consistent with earlier studies.

引用

页码：1927 / 1934

页数：8

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