Deformation study of the PCB during the flip chip assembly process by using anisotropically conductive adhesive (ACA) as a bonding agent

被引：0
|
作者：
Pinardi, K [1 ]
Liu, J [1 ]
Haug, R [1 ]
Treutler, C [1 ]
Willander, M [1 ]
机构：
[1] Chalmers Univ Technol, Gothenburg, Sweden
来源：
3RD INTERNATIONAL CONFERENCE ON ADHESIVE JOINING AND COATING TECHNOLOGY IN ELECTRONICS MANUFACTURING 1998, PROCEEDINGS | 1998年
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D O I：
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中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
In this work Finite Element is used to simulate the assembly process of the Anisotropically Conductive Adhesive Flip Chip Bonding. Since the structure is complex and consists of composite materials. We first try to study the different models of the PCB substrate, which will lead to different results in our numerical calculations. The stress during the assembly process will also be discussed. We will give our preliminary results in optimising the stress generated by varying our process parameter such as: temperature and forces.
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页码：34 / 37
页数：4
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