共 11 条
- [1] Power Noise Suppression in Multilayer Printed Circuit Boards Using Electromagnetic Bandgap in Both Power and Ground Planes 2011 IEEE ELECTRICAL DESIGN OF ADVANCED PACKAGING AND SYSTEMS SYMPOSIUM (EDAPS), 2011,
- [4] Modeling, Analysis, and Design for Noise Suppression Using Embedded Planar Capacitors in Multilayered Printed Circuit Boards IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2014, 4 (05): : 882 - 891
- [5] Power Noise Suppression Using Power-and-Ground Via Pairs in Multilayered Printed Circuit Boards IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2011, 1 (03): : 374 - 385
- [6] A Comparative Investigation on Power Noise Suppression Methods between Two Blocks in Printed Circuit Boards 2014 15TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2014, : 560 - 563
- [7] Noise Immunity Design for Multilayer Printed Circuit Boards Using Electromagnetic Simulation 2015 IEEE INTERNATIONAL SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY (EMC), 2015, : 997 - 1001
- [9] Ultra-wideband miniaturized electromagnetic bandgap structures embedded in printed circuit boards: Theory, modeling and experimental validation 2005 IEEE/ACES International Conference on Wireless Communications and Applied Computational Electromagnetics, 2005, : 791 - 796
- [10] Miniaturized Wide- and Dual-Band Multilayer Electromagnetic Bandgap For Antenna Isolation and on-Package/PCB Noise Suppression 2018 IEEE 22ND WORKSHOP ON SIGNAL AND POWER INTEGRITY (SPI), 2018,