Fatigue-induced damage and crack growth of Cu processed by ECAP

被引：1

作者：

Goto, Masahiro ^{[1
]}

Morita, Kakeru ^{[1
]}

Kitamura, Jyunichi ^{[1
]}

Baba, Masataka ^{[1
]}

Han, Seung-Zeon ^{[2
]}

Ahn, Jee-Hyuk ^{[2
]}

Kim, Sangshik ^{[3
]}

机构：

[1] Oita Univ, Dept Mech Engn, Oita 8701192, Japan

[2] Korea Inst Mat Sci, Struct Mat Div, Chang Won 641831, South Korea

[3] Gyeongsang Natl Univ, Dept Mat Sci & Engn, Chinju 660701, South Korea

来源：

MODERN PHYSICS LETTERS B | 2015年 / 29卷 / 6-7期

基金：

新加坡国家研究基金会;

关键词：

Fatigue; equal channel angular pressing; ultrafine grain; copper; crack growth; ULTRAFINE-GRAINED COPPER; SEVERE PLASTIC-DEFORMATION; BEHAVIOR; METALS;

D O I：

10.1142/S021798491540028X

中图分类号：

O59 [应用物理学];

学科分类号：

摘要：

The fatigue-induced damage and crack growth behavior were studied on the ultrafine grained copper processed by equal channel angular pressing (ECAP). At high stresses, fatigue cracks were initiated at the shear bands (SBs) formed along the shear plane of the final ECAP. At low stresses, the grain coarsening occurred due to dynamic recrystallization. The slip bands were then formed inside these grains and subsequently served as an initiation sites for cracks. The direction of crack growth, either 45. or perpendicular to the loading axis, varied depending on the stress. The formation and growth mechanisms of fatigue crack are discussed based on the micrographic observation of surface damage.

引用

页数：5

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