A Pixel Pitch-Matched Ultrasound Receiver for 3-D Photoacoustic Imaging With Integrated Delta-Sigma Beamformer in 28-nm UTBB FD-SOI

被引:49
作者
Chen, Man-Chia [1 ]
Perez, Aldo Pena [2 ]
Kothapalli, Sri-Rajasekhar [3 ]
Cathelin, Philippe [4 ]
Cathelin, Andreia [4 ]
Gambhir, Sanjiv Sam [5 ]
Murmann, Boris [6 ]
机构
[1] Robert Bosch Sensortec, Palo Alto, CA 94304 USA
[2] SLAC Natl Accelerator Lab, Menlo Pk, CA 94025 USA
[3] Penn State Univ, University Pk, PA 16801 USA
[4] STMicroelectronics, F-38926 Crolles, France
[5] Stanford Univ, Rad Mol Imaging Program, Stanford, CA 94305 USA
[6] Stanford Univ, Dept Elect Engn, Stanford, CA 94305 USA
关键词
3-D photoacoustic (PA) imaging; analog-todigital conversion (ADC); capacitive micromachined ultrasound transducer (CMUT); CMOS; delta-sigma modulation; FDSOI; matrix transducer array; subarray beamforming; ultrasound (US); AMPLIFIERS;
D O I
10.1109/JSSC.2017.2749425
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This paper presents a pixel pitch-matched readout chip for 3-D photoacoustic (PA) imaging, featuring a dedicated signal conditioning and delta-sigma modulation integrated within a pixel area of 250 mu m by 250 mu m. The proof-of-concept receiver was implemented in an STMicroelectronics's 28-nm Fully Depleted Silicon On Insulator technology, and interfaces to a 4 x 4 subarray of capacitive micromachined ultrasound transducers (CMUTs). The front-end signal conditioning in each pixel employs a coarse/fine gain tuning architecture to fulfill the 90-dB dynamic range requirement of the application. The employed delta-sigma beamforming architecture obviates the need for area-consuming Nyquist ADCs and thereby enables an efficient in-pixel A/D conversion. The per-pixel switched-capacitor Delta Sigma modulator leverages slewing-dominated and area-optimized inverter-based amplifiers. It occupies only 1/4th of the pixel, and its area compares favorably with state-of-the-art designs that offer the same SNR and bandwidth. The modulator's measured peak signal-to-noise-and-distortion ratio is 59.9 dB for a 10-MHz input bandwidth, and it consumes 6.65 mW from a 1-V supply. The overall subarray beamforming approach improves the area per channel by 7.4 times and the single-channel SNR by 8 dB compared to prior art with similar delay resolution and power dissipation. The functionality of the designed chip was evaluated within a PA imaging experiment, employing a flip-chip bonded 2-D CMUT array.
引用
收藏
页码:2843 / 2856
页数:14
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