Simulation Studies on Bipolar Electrostatic Chucks

被引：0
|
作者：
Li, Chih-Hung [1 ]
Chiu, Yi-Fan [1 ]
Yu, Yi-Hsiuan [2 ]
Chen, Jian-Zhang [1 ]
机构：
[1] Natl Taiwan Univ, Grad Inst Appl Mech, Taipei 10617, Taiwan
[2] Natl Chung Shan Inst Sci & Technol, Chem Syst Res Div, Taoyuan 32546, Taiwan
来源：
2015 10TH INTERNATIONAL MICROSYSTEMS, PACKAGING, ASSEMBLY AND CIRCUITS TECHNOLOGY CONFERENCE (IMPACT) | 2015年
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
We use Comsol Multiphysics, a finite element simulation tool to study a bipolar electrostatic chuck (E-chuck). The influences of the substrate and dielectric types, wafer thickness, and air gap are investigated.
引用
收藏
页码：382 / 385
页数：4
相关论文
共 50 条
  • [1] Bipolar electrostatic chucks
    Kanno, S
    Usui, T
    PLASMA ETCHING PROCESSES FOR SUB-QUARTER MICRON DEVICES, PROCEEDINGS, 2000, 99 (30): : 64 - 72
  • [2] Performance evaluation of bipolar electrostatic chucks
    Kanno, Seiichiro
    Usui, Tatehito
    Shinku/Journal of the Vacuum Society of Japan, 1999, 42 (09): : 840 - 844
  • [3] Electrostatic chucks for lithography applications
    Kalkowski, G
    Risse, S
    Harnisch, G
    Guyenot, V
    MICROELECTRONIC ENGINEERING, 2001, 57-8 : 219 - 222
  • [4] Electrostatic chucks in wafer processing
    Semiconductor International, 1995, 18 (04):
  • [5] MANUFACTURING ISSUES OF ELECTROSTATIC CHUCKS
    WRIGHT, DR
    CHEN, L
    FEDERLIN, P
    FORBES, K
    JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 1995, 13 (04): : 1910 - 1916
  • [6] EFFECT OF ADDITIVES ON THE ELECTROSTATIC FORCE OF ALUMINA ELECTROSTATIC CHUCKS
    WATANABE, T
    KITABAYASHI, T
    NIPPON SERAMIKKUSU KYOKAI GAKUJUTSU RONBUNSHI-JOURNAL OF THE CERAMIC SOCIETY OF JAPAN, 1992, 100 (01): : 1 - 6
  • [7] Characterization of the clamp pressure of electrostatic chucks
    Ziemann, M.
    Voss, S.
    Baldus, O.
    Schmidt, V.
    EXTREME ULTRAVIOLET (EUV) LITHOGRAPHY, 2010, 7636
  • [8] Mechanisms underlying temperature uniformity in electrostatic chucks through experimental and simulation methods
    Liu, Chanjuan
    Gao, Jiuru
    He, Zhiwei
    Han, Kang
    Yang, Zhen
    Xu, Kaidong
    Zhuang, Shiwei
    APPLIED THERMAL ENGINEERING, 2024, 238
  • [9] Prediction of residual clamping force for Coulomb type and Johnsen-Rahbek type of bipolar electrostatic chucks
    Wang, Kesheng
    Lu, Yijia
    Cheng, Jia
    Ji, Linhong
    PROCEEDINGS OF THE INSTITUTION OF MECHANICAL ENGINEERS PART C-JOURNAL OF MECHANICAL ENGINEERING SCIENCE, 2019, 233 (01) : 302 - 312
  • [10] Characterization of Electrostatic Chucks for Extreme Ultraviolet Lithography
    Mulholland, Tom C.
    Zeuske, Jacob R.
    Vukkadala, Pradeep
    Engelstad, Roxann L.
    ALTERNATIVE LITHOGRAPHIC TECHNOLOGIES, 2009, 7271
12345