Direct writing of copper conductive patterns by ink-jet printing

被引:452
作者
Park, Bong Kyun
Kim, Dongjo
Jeong, Sunho
Moon, Jooho [1 ]
Kim, Jang Sub
机构
[1] Yonsei Univ, Dept Mat Sci & Engn, Seoul 120749, South Korea
[2] Samsung Elect Co Ltd, LCD R&D, Gyeonggi Do 449711, South Korea
关键词
ink-jet; printing; conductive pattern; copper nanoparticle;
D O I
10.1016/j.tsf.2006.11.142
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Ink-jet printing of metal nanoparticles is an attractive method for direct patterning conductive metal lines owing to low-cost, low-waste, and simple process. While most of the researches here focused on novel metals such as gold and silver, we have developed a conductive ink containing copper nanoparticles as an alternative that is inexpensive conductive material. Copper particles with a size of 40-50 nm were synthesized by polyol process, from which the well-dispersed conductive ink with low viscosity was prepared. We have successfully demonstrated a direct writing of the conductive lines using Cu conductive ink. The ink-jet printed copper patterns exhibited metal-like appearance and became highly conductive upon heat treatments. The resistivity of the film reached to 17.2 mu Omega cm at 325 degrees C for I h in vacuum. (c) 2006 Elsevier B.V. All rights reserved.
引用
收藏
页码:7706 / 7711
页数:6
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