The future of electronics manufacturing is revealed in the fine print

被引：17
作者：
Nuzzo, RG [1 ]
机构：
[1] Univ Illinois, Dept Chem, Urbana, IL 61801 USA
来源：
PROCEEDINGS OF THE NATIONAL ACADEMY OF SCIENCES OF THE UNITED STATES OF AMERICA | 2001年 / 98卷 / 09期
关键词：
D O I：
10.1073/pnas.101134798
中图分类号：
O [数理科学和化学]; P [天文学、地球科学]; Q [生物科学]; N [自然科学总论];
学科分类号：
07 ; 0710 ; 09 ;
摘要：
引用
收藏
页码：4827 / 4829
页数：3
相关论文
共 27 条
  • [1] [Anonymous], 2001, INTEL TECHNOLOGY J
  • [2] Bernius MT, 2000, ADV MATER, V12, P1737, DOI 10.1002/1521-4095(200012)12:23<1737::AID-ADMA1737>3.0.CO
  • [3] 2-N
  • [4] Adhesion and friction of self-assembled organic monolayers
    Chaudhury, MK
    [J]. CURRENT OPINION IN COLLOID & INTERFACE SCIENCE, 1997, 2 (01) : 65 - 69
  • [5] The great disruption
    Christensen, C
    Craig, T
    Hart, S
    [J]. FOREIGN AFFAIRS, 2001, 80 (02) : 80 - +
  • [6] SYNTHESIS, STRUCTURE, AND PROPERTIES OF MODEL ORGANIC-SURFACES
    DUBOIS, LH
    NUZZO, RG
    [J]. ANNUAL REVIEW OF PHYSICAL CHEMISTRY, 1992, 43 : 437 - 463
  • [7] Flink S, 2000, ADV MATER, V12, P1315
  • [8] Soft matter in a tight spot
    Granick, S
    [J]. PHYSICS TODAY, 1999, 52 (07) : 26 - 31
  • [9] Electron and proton conducting polymers: recent developments and prospects
    Inzelt, G
    Pineri, M
    Schultze, JW
    Vorotyntsev, MA
    [J]. ELECTROCHIMICA ACTA, 2000, 45 (15-16) : 2403 - 2421
  • [10] JEONG HJ, 1994, SOLID STATE TECHNOL, V37, P39
123