In-situ study of stress evolution during solid state reaction of Pd with Si(001) using synchrotron radiation

被引:6
作者
Megdiche, A
Gergaud, P [1 ]
Curtil, C
Thomas, O
Chenevier, B
Mazuelas, A
机构
[1] Univ Aix Marseille 3, CNRS, TECSEN, F-13397 Marseille 20, France
[2] Ecole Natl Super Phys Grenoble, Mat & Genie Phys Lab, CNRS, F-38402 St Martin Dheres, France
[3] ESRF, Grenoble, France
关键词
stress; reactivity; Pd silicide; thin films;
D O I
10.1016/S0167-9317(03)00427-1
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Using X-ray diffraction experiments and curvature measurements, in-situ real-time measurements of stress are performed during solid state reaction of a palladium thin film with Si(001). From X-ray diffraction measurements and using the sin(2)psi method, we found out that the stress in the metal and in the silicide is compressive. This stress decreases all along the solid-state reaction for the silicide. We then compared our results with the qualitative model proposed by Zhang and d'Heurle. This model suggests the development of a high compressive stress (-2.4 GPa) in the silicide. (C) 2003 Elsevier B.V. All rights reserved.
引用
收藏
页码:436 / 441
页数:6
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