Comparative Study on the Effect of Temperature, Pressure and Grain Size on the Creep Behavior of Monolithic Titanium Aluminide Alloy through Molecular Dynamics Simulation

The creep behavior of an intermetallic compound plays a decisive role over the creep characteristics of various intermetallic alloys through the diffusion behavior of various elements which leads to tailor its creep characteristics. In this study, the creep behavior (in compression mode) of monolithic titanium aluminide (Ti3Al) alloy has been analyzed using molecular dynamics simulation under varying grain size (2.2 nm, 3.1 nm and 4.2 nm), pressure (1.5 GPa, 2 GPa and 2.5 GPa) and temperature (500 K and 700 K). Through the above analysis, it is found that the grain size of titanium aluminide alloy leads to invoke adverse effect over the creep characteristics followed by the temperature and the pressure. Furthermore, it is stated that the vacancy and lattice diffusion behavior under the lowermost and the higher temperature plays a dominant role over the creep mechanics of titanium aluminide alloy, owing to the dominant diffusion behavior of titanium and aluminum atoms.