Quantum-based simulation analysis of scaling in ultrathin body device structures

被引:27
作者
Kumar, A [1 ]
Kedzierski, J [1 ]
Laux, SE [1 ]
机构
[1] IBM Corp, Div Res, TJ Watson Res Ctr, IBM,SRDC, Yorktown Hts, NY 10598 USA
关键词
modeling; MOSFET scaling; silicon-on-insulator (SOI) technology;
D O I
10.1109/TED.2005.844792
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
We present self-consistent solutions of ultrathin body device structures to understand the influence of quantum-mechanical confinement on the predictions of classical scaling theory. We show that two-dimensional (2-D) electrostatics considerations play a more dominant role than quantum-mechanical effects in the subthreshold behavior of ultrathin fully depleted silicon-on-insulator structures. We also show how modifications to the doping profile can be used to alleviate 2-D short-channel effects.
引用
收藏
页码:614 / 617
页数:4
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