Micromachining of {111} plates in [001] oriented silicon

被引：24

作者：

Berenschot, JW ^{[1
]}

Oosterbroek, RE ^{[1
]}

Lammerink, TSJ ^{[1
]}

Elwenspoek, MC ^{[1
]}

机构：

[1] Univ Twente, MESA Res Inst, NL-7500 AE Enschede, Netherlands

来源：

JOURNAL OF MICROMECHANICS AND MICROENGINEERING | 1998年 / 8卷 / 02期

关键词：

Anisotropy - Etching - Masks - Micromachining - Plate metal - Silicon wafers;

D O I：

10.1088/0960-1317/8/2/015

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

We introduce a new way to micromachine [111] oriented plates on [001] silicon wafers by anisotropic wet chemical etching. The process involves double-sided wafer-processing. Precision alignment, however, is only required at one side.

引用

页码：104 / 107

页数：4

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