Electrical wire explosion process of copper/silver hybrid nano-particle ink and its sintering via flash white light to achieve high electrical conductivity

被引:29
作者
Chung, Wan-Ho [1 ]
Hwang, Yeon-Taek [1 ]
Lee, Seung-Hyun [3 ]
Kim, Hak-Sung [1 ,2 ]
机构
[1] Hanyang Univ, Dept Mech Convergence Engn, 17 Haendang Dong, Seoul 133791, South Korea
[2] Hanyang Univ, Inst Nano Sci & Technol, Seoul 133791, South Korea
[3] Korea Inst Machinery & Mat, Dept Printed Elect, 156 Gajungbuk, Daejeon 305343, South Korea
基金
新加坡国家研究基金会;
关键词
copper and silver nano-ink; wire explosion; flash light sintering; low porosity; printed electronics; COPPER NANOPARTICLES; TEMPERATURE; ELECTRONICS; ACETYLIDE; CIRCUITS;
D O I
10.1088/0957-4484/27/20/205704
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
In this work, combined silver/copper nanoparticles were fabricated by the electrical explosion of a metal wire. In this method, a high electrical current passes through the metal wire with a high voltage. Consequently, the metal wire evaporates and metal nanoparticles are formed. The diameters of the silver and copper nanoparticles were controlled by changing the voltage conditions. The fabricated silver and copper nano-inks were printed on a flexible polyimide (PI) substrate and sintered at room temperature via a flash light process, using a xenon lamp and varying the light energy. The microstructures of the sintered silver and copper films were observed using a scanning electron microscope (SEM) and a transmission electron microscope (TEM). To investigate the crystal phases of the flash-light-sintered silver and copper films, x-ray diffraction (XRD) was performed. The absorption wavelengths of the silver and copper nanoinks were measured using ultraviolet-visible spectroscopy (UV-vis). Furthermore, the resistivity of the sintered silver and copper films was measured using the four-point probe method and an alpha step. As a result, the fabricated Cu/Ag film shows a high electrical conductivity (4.06 mu Omega cm), which is comparable to the resistivity of bulk copper (1.68 mu Omega cm). In addition, the fabricated Cu/Ag nanoparticle film shows superior oxidation stability compared to the Cu nanoparticle film.
引用
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页数:13
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