Assessment of heat transfer and pressure drop of metal foam-pin-fin heat sink

被引:10
|
作者
Alfellag, Mohanad A. [1 ]
Ahmed, Hamdi E. [1 ]
Jehad, Mohammed Gh [1 ]
Hameed, Marwan [2 ]
机构
[1] Univ Anbar, Dept Mech Engn, Ramadi 31001, Iraq
[2] Amer Univ Bahrain, Riffa, Bahrain
关键词
Numerical assessment; Heat transfer; Pressure drop; Metal foam; Pin-fin heat sink; Turbulent flow; THERMAL PERFORMANCE; FLOW; ENHANCEMENT; OPTIMIZATION;
D O I
10.1016/j.ijthermalsci.2021.107109
中图分类号
O414.1 [热力学];
学科分类号
摘要
Numerical investigation on Metal Foam Pin-Fin Heat Sink (MFPFHS) has been conducted and compared to the traditional Solid Pin-Fin Heat Sink (SPFHS). For investigating turbulent convection heat transfer and friction factor characteristics in the MPFHS, the 3D steady continuity, momentum, and energy equations are discretized using the finite volume approach. The key parameters investigated here are; the pin diameter ratio (DR) i.e., reducing the upper diameter and increasing the lower diameter simultaneously, the number of pins and the pins' height ratio (HR) i.e., reducing the pin height and increasing its diameter simultaneously. The overall pin volume is retained constant throughout the whole study. The results show that (i) the MFPF exhibit a superior enhancement in the heat dissipation and reduction in the frictional losses compared to the solid pin-fin (SPF), (ii) a great heat transfer and PEC enhancement is observed when DR increases associated with a decrease in the friction factor, (iii) heat transfer and performance evaluation criteria (PEC) enhancement (with a maximum value of 3.7) is obtained when the number of MFPF increases with a large decrease in the friction factor, (iv) high augmentation in PEC with a peak value of 3.8 but up to a certain value is seen, however, with an association of high increase in the friction factor.
引用
收藏
页数:15
相关论文
共 50 条
  • [11] Optimization of different pin-fins on heat transfer and pressure drop of a heat sink for antifreeze liquid case
    Rostami, Sara
    Nadooshan, Afshin Ahmadi
    Raisi, Afrasiab
    Bayareh, Morteza
    JOURNAL OF THE TAIWAN INSTITUTE OF CHEMICAL ENGINEERS, 2023, 148
  • [12] Analysis on heat transfer and pressure drop of a microchannel heat sink with dimples and vortex generators
    Lu, Gaofeng
    Zhai, Xiaoqiang
    INTERNATIONAL JOURNAL OF THERMAL SCIENCES, 2019, 145
  • [13] Research on Properties of Fluid Pressure Drop for Electric Vehicle IGPT Pin Fin Heat Sink
    Bailin, F.
    Pei, Z.
    Ganghan, H.
    YanJun, W.
    INTERNATIONAL JOURNAL OF ENGINEERING, 2015, 28 (04): : 627 - 633
  • [14] Application of vortex generators to heat transfer enhancement of a pin-fin heat sink
    Li, Hung-Yi
    Liao, Wan-Rong
    Li, Tian-Yang
    Chang, Yan-Zuo
    INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER, 2017, 112 : 940 - 949
  • [15] An investigation into flow boiling heat transfer and pressure drop in a pin-finned heat sink
    McNeil, D. A.
    Raeisi, A. H.
    Kew, P. A.
    Hamed, R. S.
    INTERNATIONAL JOURNAL OF MULTIPHASE FLOW, 2014, 67 : 65 - 84
  • [16] Machine learning approach to predict heat transfer and fluid flow characteristics of integrated pin fin-metal foam heat sink
    Tikadar, Amitav
    Kumar, Satish
    NUMERICAL HEAT TRANSFER PART B-FUNDAMENTALS, 2023,
  • [17] Investigation of planted pin fins for heat transfer enhancement in plate fin heat sink
    Yang, Yue-Tzu
    Peng, Huan-Sen
    MICROELECTRONICS RELIABILITY, 2009, 49 (02) : 163 - 169
  • [18] Experimental and numerical investigation on fluid flow and heat transfer behaviour of foam cladded pin fin heat sink
    Guler, Nursel
    Bayer, Ozgur
    Solmaz, Ismail
    APPLIED THERMAL ENGINEERING, 2024, 256
  • [19] Numerical Investigation on Heat Transfer Enhancement with Perforated Square Micro-Pin Fin Heat Sink for Electronic Cooling Application
    Gupta, Deepa
    Saha, Probir
    Roy, Somnath
    2019 IEEE 21ST ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC), 2019, : 241 - 246
  • [20] Thermal Performance of Metal Foam Heat Sink With Pin Fins for Nonuniform Heat Flux Electronics Cooling
    Li, Yongtong
    Gong, Liang
    Xu, Minghai
    Joshi, Yogendra
    JOURNAL OF ELECTRONIC PACKAGING, 2021, 143 (01)