Nano-Silver Pressureless Sintering Technology in Power Module Packaging

被引：4

作者：

Gao, Lilan ^{[1
,2
]}

Tian, Xinwei ^{[1
]}

Wu, Chengjin ^{[1
]}

Xing, Yulong ^{[2
,3
]}

Tan, Yansong ^{[1
,2
]}

Chen, Xu ^{[4
]}

Lu, Guoquan ^{[5
]}

机构：

[1] Tianjin Univ Technol, Tianjin Key Lab Adv Mech Syst Design & Intelligen, Tianjin 300384, Peoples R China

[2] Tianjin Univ f Technol, Nat Demonstrat Ctr Expt Mech & Elect Engn, Tianjin 300384, Peoples R China

[3] Tianjin Yixunyuan New Mat Technol Co LTD, Tianjin 301600, Peoples R China

[4] Tianjin Univ, Sch Chem Engn, Tianjin 300350, Peoples R China

[5] Virginia Polytech Inst & State Univ, Sch Mat Sci & Engn, Blacksburg, VA 24061 USA

来源：

PROCEEDINGS OF 2022 IEEE INTERNATIONAL CONFERENCE ON MECHATRONICS AND AUTOMATION (IEEE ICMA 2022) | 2022年

基金：

中国国家自然科学基金;

关键词：

Silver pressureless sintering technology; Chip-level; Substrate-level; Development trend; DIE-ATTACH; MICROSTRUCTURE; TEMPERATURE; RELIABILITY; NANOSILVER;

D O I：

10.1109/ICMA54519.2022.9856054

中图分类号：

TP [自动化技术、计算机技术];

学科分类号：

0812 ;

摘要：

Power electronics may operate at high temperatures even above 200.C. In recent years, silver sintering technology is being gradually applied in high-temperature power electronic packaging due to its excellent thermal, electrical, and mechanical properties. Compared with early pressure-assisted silver sintering technology, silver pressureless sintering technology can simplify the sintering process and reduce capital investment. Silver sintering technology in chip-level and substrate-level packaging is presented as follows: firstly, the traditional and the state-of-the-art chip-level silver pressureless sintering technologies are reviewed: Secondly, the large-area substrate-level silver pressureless sintering technology is introduced, optimized and verified by experiments. Finally, the challenges and future outlook of silver pressureless sintering technology are summarized.

引用

页码：1452 / 1456

页数：5

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