Thermal impedance spectroscopy of power modules

被引：32

作者：

Hensler, A. ^{[1
]}

Wingert, D. ^{[1
]}

Herold, Ch. ^{[1
]}

Lutz, J. ^{[1
]}

Thoben, M. ^{[2
]}

机构：

[1] Tech Univ Chemnitz, Chemnitz, Germany

[2] Infineon Technol AG, Warstein, Germany

来源：

MICROELECTRONICS RELIABILITY | 2011年 / 51卷 / 9-11期

关键词：

D O I：

10.1016/j.microrel.2011.06.039

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

In this paper, a method of thermal impedance spectroscopy for power modules is presented. This method enables a high resolution non-destructive analysis of the power module by means of electrical measurement and subsequent mathematical evaluation. The result provides a separation of partial thermal resistances corresponding material layers and facilitates a plausible estimation of geometrical dimensions of the power module package within the heat flow path. This method is applied for localization of failures during power cycling test. (C) 2011 Elsevier Ltd. All rights reserved.

引用

页码：1679 / 1683

页数：5

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