A Stacked Embedded DRAM Array for LPDDR4/4X using Hybrid Bonding 3D Integration with 34GB/s/1Gb 0.88pJ/b Logic-to-Memory Interface

被引：35

作者：

Bai Fujun ^{[1
,4
]}

Jiang Xiping ^{[1
,5
]}

Wang Song ^{[1
,6
]}

Yu Bing ^{[1
]}

Tan Jie ^{[1
]}

Zuo Fengguo ^{[1
]}

Wang Chunjuan ^{[1
]}

Wang Fan ^{[1
]}

Long Xiaodong ^{[1
]}

Yu Guoqing ^{[1
]}

Fu Ni ^{[1
]}

Li Qiannan ^{[1
]}

Li Hua ^{[1
]}

Wang Kexin ^{[1
]}

Duan Huifu ^{[1
]}

Bai Liang ^{[1
]}

Jia Xuerong ^{[1
]}

Li Jin ^{[1
]}

Li Mei ^{[1
]}

Wang Zhengwen ^{[1
]}

Hu Sheng ^{[2
]}

Zhou Jun ^{[2
]}

Zhan Qiong ^{[2
]}

Sun Peng ^{[2
]}

Yang Daohong ^{[2
]}

Kau, Cheichan ^{[2
]}

Yang, David ^{[3
]}

Ho, Ching-Sung ^{[3
]}

Sun Hongbin ^{[4
]}

Lv Hangbing ^{[5
]}

Liu Ming ^{[5
]}

Kang Yi ^{[6
]}

Ren Qiwei ^{[1
]}

机构：

[1] Xian UniIC Semicond Co Ltd, Xian, Shaanxi, Peoples R China

[2] Wuhan Xinxin Semicond Mfg Co Ltd, Wuhan, Hubei, Peoples R China

[3] Powerchip Semicond Mfg Corp, Hsinchu, Taiwan

[4] Xi An Jiao Tong Univ, Xian, Shaanxi, Peoples R China

[5] Chinese Acad Sci, Inst Microelect, Beijing, Peoples R China

[6] Univ Sci & Technol China, Hefei, Anhui, Peoples R China

来源：

2020 IEEE INTERNATIONAL ELECTRON DEVICES MEETING (IEDM) | 2020年

关键词：

D O I：

10.1109/IEDM13553.2020.9372039

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Increasing demand for DRAM scaling and high-bandwidth has driven DRAM technology to 3D/2.5D integration. With the innovative Hybrid Bonding technology, a new Stacked Embedded DRAM (SEDRAM) architecture was developed on LPDDR4/4X product. In this SEDRAM, a DRAM array wafer and logic wafer were fabricated separately and then face-to-face fusion connected through ultra-highdensity, low-resistance Hybrid Bonding. By separating the control, I/O, DFT and periphery circuits to a logic die, SEDRAM offers a novel approach to DRAM product development and accomplishes an extremely high-bandwidth logic-to-memory interface speed of 34GBps per 1Gb with low power consumption as low as 0.88pJ/bit.

引用

页数：4

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