Reliability Comparison of Aged SAC Fine-Pitch Ball Grid Array Packages Versus Surface Finishes

被引：48

作者：

Hai, Zhou ^{[1
]}

Zhang, Jiawei ^{[1
]}

Shen, Chaobo ^{[1
]}

Evans, John L. ^{[1
]}

Bozack, Michael J. ^{[1
]}

Basit, Munshi M. ^{[1
]}

Suhling, Jeffrey C. ^{[1
]}

机构：

[1] Auburn Univ, Natl Sci Fdn Ctr Adv Vehicle & Extreme Environm E, Auburn, AL 36849 USA

来源：

IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY | 2015年 / 5卷 / 06期

关键词：

Electroless Ni/electroless Pd/immersion Au (ENEPIG); electroless Ni/immersion Au (ENIG); isothermal aging; Pb-free; reliability; Sn-Ag-Cu (SAC); solder; FREE SOLDER JOINTS; DROP RELIABILITY; THERMAL FATIGUE;

D O I：

10.1109/TCPMT.2015.2420566

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Pb-free solder joints exposed to elevated isothermal temperatures for prolonged periods of time undergo microstructural and mechanical evolution, which degrades the joint electrical performance. We report the effect of isothermal aging on the reliability of Sn-Ag-Cu (SAC) assemblies on three different surface finishes [immersion Ag (ImAg), electroless Ni/immersion Au (ENIG), and electroless Ni/electroless Pd/immersion Au (ENEPIG)]. The characteristic life for SAC alloys in 10- and 15-mm ball grid array packages on lImAg degraded over 40% after an 85 degrees C/12 months aging and over 50% during a 125 degrees C/12 months aging. ENIG and ENEPIG outperformed ImAg for all aging treatments. For passive components (2512 resistors) on ImAg, the reliability performance degraded 16.7%/28.1% after a 1-year aging at 85 degrees C/125 degrees C. Failure analysis showed dramatic intermetallic binary Cu-Sn and ternary Ni-Cu-Sn film growth at the bottom of the solder joint interfaces for ImAg and ENIG/ENEPIG. For 125 degrees C-aged samples, the cracks appeared at the corners of both package and board sides of the solder ball and propagated along (near) the intermetallic compound location. For the case of aged fine-pitch packages, the failures tended to start at the component side solder ball corner and then propagate along an angled path downward into the bulk solder.

引用

页码：828 / 837

页数：10