Investigation of mixing Co in ultra-thin NiPt silicide films

被引：0
|
作者：
Xu, Peng [1 ]
Zhou, Xiangbiao [1 ]
Fu, Chaochao [1 ]
Pan, Jianfeng [1 ]
Wu, Dongping [1 ]
机构：
[1] Fudan Univ, State Key Lab ASIC & Syst, Shanghai 200433, Peoples R China
来源：
2014 INTERNATIONAL WORKSHOP ON JUNCTION TECHNOLOGY (IWJT) | 2014年
关键词：
D O I：
暂无
中图分类号：
TP301 [理论、方法];
学科分类号：
081202 ;
摘要：
Influence of mixing Co on the structural stability of ultra-thin NiPt silicide film is investigated in this paper. Experiments of variation of the total thickness and Ni : Co : Pt ratio of the Ni, Co and Pt mixtures are carefully designed and carried out. Compared with the 6-nm NiPt sample silicide film, films of Ni, Co and Pt mixtures with similar total metal thickness demonstrate similar to 150 degrees C higher agglomeration temperature. The agglomeration temperature and phase transformation characteristics are found to be relatively stable, regardless of the variation of the total thickness and Ni : Co : Pt ratio in the Ni, Co and Pt mixtures.
引用
收藏
页码：199 / 201
页数：3
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