Interaction of Scaling Trends in Processor Architecture and Cooling

被引：25

作者：

Huang, Wei ^{[1
,4
]}

Stan, Mircea R. ^{[3
]}

Gurumurthi, Sudhanva ^{[1
]}

Ribando, Robert J. ^{[2
]}

Skadron, Kevin ^{[1
]}

机构：

[1] Univ Virginia, Dept Comp Sci, Charlottesville, VA 22903 USA

[2] Univ Virginia, Dept Mech & Aerosp Engn, Charlottesville, VA 22903 USA

[3] Univ Virginia, Dept Elect & Comp Engn, Charlottesville, VA 22903 USA

[4] IBM Austin Res Lab, Austin, TX USA

来源：

26TH ANNUAL IEEE SEMICONDUCTOR THERMAL MEASUREMENT AND MANAGEMENT SYMPOSIUM, PROCEEDINGS 2010 | 2010年

关键词：

Technology scaling; manycore architecture; processors; cooling solution; 3D integration; VLSI;

D O I：

10.1109/STHERM.2010.5444290

中图分类号：

O414.1 [热力学];

学科分类号：

摘要：

It is predicted that two important trends are likely to accompany traditional CMOS semiconductor technology scaling - chip multiprocessors and 3D integration. With the ever-increasing power consumption and the consequent difficulty in heat removal, it is important to consider the limits and implications of different cooling methods for the upcoming many-core and 3D era. In this paper, we consider both technology scaling and manycore architecture scaling trends in conjunction with conventional air cooling and advanced microchannel cool-ing for both 2D and 3D microprocessors and identify interesting inflection design points down the road.

引用

页码：198 / 204

页数：7

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