Impact of Shorting Vias Placement on Embedded Planar Electromagnetic BandGap Structures Within Multilayer Printed Circuit Boards

被引：39
作者：
de Paulis, Francesco [1 ]
Raimondo, Leo [1 ]
Orlandi, Antonio [1 ]
机构：
[1] Univ Aquila, Dept Elect Engn, Electromagnet Compatibil UAq EMC Lab, I-67040 Laquila, Italy
来源：
IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES | 2010年 / 58卷 / 07期
关键词：
Electromagnetic bandgap (EBG); embedded EBG; power integrity; via placement; SELECTIVE VALIDATION FSV; GROUND BOUNCE NOISE; SUPPRESSION; DESIGN; SURFACES; CEM;
D O I：
10.1109/TMTT.2010.2050029
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
This paper investigates the power integrity behavior of planar electromagnetic bandgap (EBG) structures embedded between two solid layers within the stack-up of a multilayer printed circuit board. The bandgap generation and power integrity performance of the embedded EBG can be achieved only by placing vias shorting the solid planes above and below the patterned layer. The vias inhibit the resonances of the cavity made by the two solid planes, ensuring the designed bandgap, as if the planar EBG was laid out on an outer stack-up layer. The impact of the stitching vias' number and location is addressed and the concepts of regular, global, random, or local via placement are introduced.
引用
收藏
页码：1867 / 1876
页数：10
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