Experimental electrical characterization of on-chip interconnects

被引：0
|
作者：
Biswas, B
Glasser, A
Lipa, S
Steer, M
Franzon, P
Griffis, D
Russell, P
机构：
来源：
ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING | 1997年
关键词：
D O I：
10.1109/EPEP.1997.634038
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
引用
收藏
页码：57 / 59
页数：3
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