Experimental electrical characterization of on-chip interconnects

被引：0
|
作者：
Biswas, B
Glasser, A
Lipa, S
Steer, M
Franzon, P
Griffis, D
Russell, P
机构：
来源：
ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING | 1997年
关键词：
D O I：
10.1109/EPEP.1997.634038
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
引用
收藏
页码：57 / 59
页数：3
相关论文
共 50 条
  • [31] Characterization and modeling of multiple coupled on-chip interconnects on silicon substrate
    Zheng, J
    Tripathi, VK
    Weisshaar, A
    ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING, 2000, : 333 - 336
  • [32] A Survey of On-Chip Optical Interconnects
    Bashir, Janibul
    Peter, Eldhose
    Sarangi, Smruti R.
    ACM COMPUTING SURVEYS, 2019, 51 (06)
  • [33] Copper metallization for on-chip interconnects
    Gelatos, AV
    Nguyen, BY
    Perry, K
    Marsh, R
    Peschke, J
    Filipiak, S
    Travis, E
    Thompson, M
    Saaranen, T
    Tobin, PJ
    Mogab, CJ
    MICROELECTRONIC DEVICE AND MULTILEVEL INTERCONNECTION TECHNOLOGY II, 1996, 2875 : 346 - 357
  • [34] Efficient on-chip global interconnects
    Ho, R
    Mai, K
    Horowitz, M
    2003 SYMPOSIUM ON VLSI CIRCUITS, DIGEST OF TECHNICAL PAPERS, 2003, : 271 - 274
  • [35] Design methodology for on-chip interconnects
    Cases, M
    Smith, H
    Bowen, M
    ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING, 1998, : 27 - 30
  • [36] Comparison of Electrical, Optical and Plasmonic On-Chip Interconnects Based on Delay and Energy Considerations
    Rakheja, Shaloo
    Kumar, Vachan
    2012 13TH INTERNATIONAL SYMPOSIUM ON QUALITY ELECTRONIC DESIGN (ISQED), 2012, : 732 - 739
  • [37] Electrical analysis of single-walled carbon nanotube as gigahertz on-chip interconnects
    Zamshed Iqbal Chowdhury
    Md. Istiaque Rahaman
    M. Shamim Kaiser
    Frontiers of Information Technology & Electronic Engineering, 2017, 18 : 262 - 271
  • [38] Electrical analysis of single-walled carbon nanotube as gigahertz on-chip interconnects
    Chowdhury, Zamshed Iqbal
    Rahaman, Md. Istiaque
    Kaiser, M. Shamim
    FRONTIERS OF INFORMATION TECHNOLOGY & ELECTRONIC ENGINEERING, 2017, 18 (02) : 262 - 271
  • [39] Characterization of On-Chip Interconnects: Case Study in 28 nm CMOS Technology
    Jarihani, Arash Ebrahimi
    Sarafi, Sahar
    Koberle, Michael
    Sturm, Johannes
    Tonello, Andrea M.
    2019 27TH AUSTROCHIP WORKSHOP ON MICROELECTRONICS (AUSTROCHIP), 2019, : 93 - 99
  • [40] On-chip integrated antennas - The first challenge for reliable on-chip wireless interconnects
    Wang, Yuxin
    Makadia, Dimple
    Margala, Martin
    2006 CANADIAN CONFERENCE ON ELECTRICAL AND COMPUTER ENGINEERING, VOLS 1-5, 2006, : 1245 - +
12345