共 50 条
[32]
Wire Bonding Optimization with Fine Copper Wire for Volume Production
[J].
2010 12TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC),
2010,
:467-472
[33]
Film Over Wire (FOW) Selection for Copper Wire Application
[J].
2013 8TH INTERNATIONAL MICROSYSTEMS, PACKAGING, ASSEMBLY AND CIRCUITS TECHNOLOGY CONFERENCE (IMPACT),
2013,
:306-309
[35]
The Effect of Testing a Copper Wire and a Copper Wire Coated with SnPb Solder using a Wetting Balance Machine
[J].
WORLD CONGRESS ON ENGINEERING, WCE 2010, VOL III,
2010,
:2327-2330
[39]
NEW DEVELOPMENTS IN EXTRUDING COPPER WIRE
[J].
METALLURGIA AND METAL FORMING,
1973, 40 (11)
:357-358
[40]
THE REMOVAL OF ENAMEL FROM COPPER WIRE
[J].
JOURNAL OF SCIENTIFIC INSTRUMENTS,
1951, 28 (02)
:60-61