Multiple scattering among vias in planar waveguides using preconditioned SMCG method

被引:23
作者
Huang, CC [1 ]
Tsang, L
Chan, CH
Ding, KH
机构
[1] Univ Washington, Dept Elect Engn, Seattle, WA 98195 USA
[2] City Univ Hong Kong, Dept Elect Engn, Hong Kong, Hong Kong, Peoples R China
[3] Air Force Res Lab, Sensor Directorate, Hanscom AFB, MA 01731 USA
关键词
Foldy-Lax equation; LU; preconditioning; sparse matrix; sparse-matrix canonical grid (SMCG); through-hole via;
D O I
10.1109/TMTT.2003.821229
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Full-wave modeling for cylindrical vias in planar waveguides is formulated using Foldy-Lax multiple scattering equations. Recently, a sparse-matrix canonical-grid method based on fast Fourier transform and an iterative algorithm was proposed to solve a large-scale via problem. In this paper, we further improve computational efficiency by a preconditioning scheme based on the dominant information contained in the near field. We also discuss two methods-the sparse-matrix LU decomposition and sparse matrix iterative methods-for constructing the preconditioner, providing the tradeoffs between CPU time and memory. Results show an order of magnitude improvement over the nonpreconditioned case on the convergence rate. As an example, for 20 000 vias simulation, the solution time (per excitation and per frequency) is approximately 13 s per iteration, and 75 min to reach convergence in 320 iterations With memory requirements of 560 MB on a single Pentium 2.4-GHz processor machine. Numerical simulations are illustrated for physical problems such as ball-grid array and large-scale randomly distributed vias, where we have observed the shielding effects of the terminated vias that reduce the coupling between vias.
引用
收藏
页码:20 / 28
页数:9
相关论文
共 24 条
[1]   TIME-DOMAIN ELECTROMAGNETIC ANALYSIS OF INTERCONNECTS IN A COMPUTER CHIP PACKAGE [J].
BECKER, WD ;
HARMS, PH ;
MITTRA, R .
IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 1992, 40 (12) :2155-2163
[2]   A SPARSE-MATRIX CANONICAL-GRID METHOD FOR SCATTERING BY MANY SCATTERERS [J].
CHAN, CH ;
TSANG, L .
MICROWAVE AND OPTICAL TECHNOLOGY LETTERS, 1995, 8 (02) :114-118
[3]   Analysis of a large number of vias and differential signaling in multilayered structures [J].
Chen, HF ;
Li, Q ;
Tsang, L ;
Huang, CC ;
Jandhyala, V .
IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 2003, 51 (03) :818-829
[4]   COMPUTATION OF INDUCTANCE OF SIMPLE VIAS BETWEEN 2 STRIPLINES ABOVE A GROUND PLANE [J].
DJORDJEVIC, AR ;
SARKAR, TK .
IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 1985, 33 (03) :265-269
[5]  
EVANS DJ, 1983, PRECONDITIONING METH
[6]  
FANG J, 1998, IEEE INT CIRC PACK D
[7]   COUPLED NOISE-ANALYSIS FOR ADJACENT VIAS IN MULTILAYERED DIGITAL CIRCUITS [J].
GU, QZ ;
TASSOUDJI, MA ;
POH, SY ;
SHIN, RT ;
KONG, JA .
IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS I-FUNDAMENTAL THEORY AND APPLICATIONS, 1994, 41 (12) :796-804
[8]   FULL-WAVE CHARACTERIZATION OF A THROUGH HOLE VIA IN MULTILAYERED PACKAGING [J].
HSU, SG ;
WU, RB .
IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 1995, 43 (05) :1073-1081
[9]   Multiple scattering among vias in lossy planar waveguides using SMCG method [J].
Huang, CC ;
Tsang, L ;
Chan, CH .
IEEE TRANSACTIONS ON ADVANCED PACKAGING, 2002, 25 (02) :181-188
[10]   CAPACITANCE OF A CIRCULAR SYMMETRICAL MODEL OF A VIA HOLE INCLUDING FINITE GROUND PLANE THICKNESS [J].
KOK, P ;
DEZUTTER, D .
IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 1991, 39 (07) :1229-1234